Overheating of chips is an important part of their production process and chip makers keep looking for ways to keep their chips cool without affecting overall performance. There are reports that three top-of-the-line chips that will debut on some flagship smartphones this year may be having issues with overheating. The chips are Qualcomm Snapdragon 8 Gen 1, Samsung Exynos 2200, and MediaTek Dimension 9000, which are all top-end super-functional chips from their various manufacturers.
Taiwanese company TSMC is the manufacturer of the Dimension 9000, while the Samsung Foundry assembles both the Exynos 2200 and the Snapdragon 8 Gen 1. All three chips are manufactured using a 4nm node process and some tweets by some tipsters were made pointing to the presence. Overheating problem in these top-end chips. The leaks related to the Snapdragon 8 Gen 1, which was seen to be hot when it was put through the paces in the Motorola Edge X30, one of the few models to sport the flagship chip.
Tested the new A510 small cores in #Snapdragon8Gen1
— Golden Reviewer (@Golden_Reviewer) December 25, 2021
Compared to the A55 in SD888:
Performance +15%
Power consumption +69%
Efficiency -33%
A710 and A510 are really not looking good 😭😭😭 https://t.co/6ttZ8bOIVP pic.twitter.com/TuVFiE0Dce
TSMC has a better 4nm process than Samsung Foundry, so the Dimension 9000 can experience better performance and less overheating than the other two chips. While tipsters views aren't definitive, it remains to be seen how demand for these high-end chips stacks up this year. The global chip shortage is still projected to continue beyond the first half of 2022.
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